This prior art search report presents the mappings of the various elements of claim 1 of U.S. Patent No. 6,844,262 (’262 Patent), titled “CMP process”, from assignee Copperfield Licensing LLC, published on 18 January 2005.
This patent discloses a method of making a semiconductor structure by measuring a pattern density of a layer and calculating a polishing time sufficient to planarize a layer on a semiconductor substrate. The layer is planarized based on the polish time and then polished to a predetermined thickness.
This preliminary search report has been reviewed by U.S.-registered patent attorney.