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This prior art search report presents the mappings of the various elements of claim 1 of U.S. Patent No. 7,345,245 (‘245 Patent), titled “Robust high density substrate design for thermal cycling reliability”, from assignee Bell Semiconductor LLC, published on 18 March 2008.
This patent discloses a method of improving a semiconductor package by eliminating the occurrences of cracks in signal traces. To prevent cracks, a high stress area associated with the corner of the die is identified, and the signal traces are routed away from the ball pads connected to the high stress region.
This preliminary search report includes the following:
This ParolaPRIME™ report is not legal advice. The suggested correspondences between the features disclosed in the patent-at-issue and those disclosed in each reference reflect what Parola Analytics believes are technical similarities between those respective sets of features. Parola Analytics makes no representation concerning any legal status or effect that may arise from documents mentioned in this report, such as the validity of any apparent priority date or the assertability of any document as prior art against a patent. You should independently obtain legal counsel before attempting to rely on any portion of this report in a legal proceeding.
The references presented in this report are only preliminary and do not represent results from an exhaustive search. For the full report, request a quote.
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